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Chip maker explains how AI's giant brains are held together by better cables

Original headline: Credo at OCP 2026: Micro-Emitter Optics and AI Interconnect Reliability — eetimes.com

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At a recent tech summit, a senior executive from Credo, a semiconductor and connectivity company, detailed the growing challenge of physically connecting the massive AI systems powering today's services. As AI clusters scale to thousands of processors, the sheer number of data connections becomes a point of failure. The old mantra of using cheap copper cables whenever possible is being challenged by new optical technology.

The company is focusing on reliability, aiming to keep millions of connections running without interruption. They showcased a new cable called ZeroFlap ALC that uses micro-emitter optics to pack hundreds of fibers into a single, thin connector. This promises data center operators copper-like reliability over short distances but with the benefits of lower power, less weight, and a slimmer profile. The takeaway: the unsung heroes of the AI boom are the advanced cables that keep these colossal systems from falling apart.

Read the original at eetimes.com

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